ET6000

The EasyTube® 6000 Series Multi-Tube Horizontal Furnace Systems can be configured for batch processing of multiple wafers with up to four (4) separately configured reactors in the same system.

Our ET6000 and ET6308 systems are used worldwide in complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical systems (MEMS) fabrication plants to perform steps in the process workflow. Examples include oxidation, diffusion, silicon deposition, oxide deposition, nitride deposition, boron phosphate silicate glass, etc.

The system is designed to meet today’s safety standards for handling pyrophoric, corrosive, flammable, and toxic gases such as hydrogen, silane, germane, diborane, hydrogen chloride, and metal organic precursors. The system has application configured safety protocols embedded into relay logic, PLC, and CVDWinPrC™ software.

EasyTube 6308

EasyTube

Configured for Atmospheric or Vacuum Operation
Each process tube can be configured for either atmospheric or vacuum operation.

Cantilevered Loading System
The EasyTube® 6000 Series utilizes a cantilevered substrate loading mechanism and has a horizontal HEPA filtered laminar flow hood to minimize particle contamination during loading.

Cascade Temperature Control
Cascade temperature control provides the most accurate internal temperature profile with the responsiveness of external (furnace) temperature monitoring and control. Each zone is controlled separately and can be tuned automatically to provide the best thermal response and profiles.

Innovative Modular Platform
Our modular platform includes a range of options that can be configured to meet your specific processing requirements. Many of the options are field upgradable.

STANDARD FEATURES

  • CVDWinPrC™ system control software for real time process control, data logging, and recipe editing.
  • Mounting choices: left hand, right hand, bulkhead, ballroom.
  • Up to four (4) process tubes.
  • Cantilevered automatic substrate loading/unloading system.
  • Wafer sizes up to 200 mm (3 stack furnace), Wafer sizes up to 150 mm (4 stack furnace).
  • Up to 25 to 50 wafers per load (process dependent). Larger loads are available on request.
  • Proprietary real-time cascade process temperature control.
  • Four (4) mass flow controlled UHP gas lines per process tube.
  • Atmospheric and low pressure process configurations available.
  • User settable warnings and alarms.
  • Application configured safety systems.
  • Comprehensive software and hardware safety interlocks.
  • One (1) year warranty.
  • Semi – S2/S8 and CE compliant.

OPTIONS

  • Dry (oxygen) or wet (H2O bubbler) oxidation.
  • Pyrogenic oxidation using an independent chamber to generate pure steam.
  • Rolling furnace/furnaces for rapid heating and cooling.
  • Liquid/solid source vapor delivery kit.
  • Run/vent: stabilizes gas flows (bypassing the process tube) before flowing into process tube.
  • Bubbler liquid auto refill.
  • Air to water heat exchanger for cooling water.
  • Residual gas analyzer.
  • EasyGas™ hazardous gas cabinets.
  • EasyPanel™ gas panels for argon, nitrogen, helium, oxygen.
  • EasyExhaust™ exhaust gas conditioning system (scrubber/pyrolyzer).
  • Other options available on request, please contact Factory for details.

FACILITY REQUIREMENTS

  • Electrical* : 208 VAC, 60 Hz, L1, L2, L3, N, G 30 – 160 AMPS.
  • Dimensions* : 118″ Length, 43″ Width, 90″ Height, 3500 – 4500 lbs.
  • Cabinet Exhaust* : 500 scfm(furnace compartment) 300 scfm(gas compartment), 1″WC.
  • Cooling Water* : 2 gpm 30-60 psig.
  • Pneumatic Supply : Clean DRY Air or N2, 1 SCFM, 80 psig.
  • Facility Nitrogen* : 30 slpm 20 psig.
  • Process Gases : Customer specified.
  • *NOTE : Electrical varies with country, Facility requirements vary with system options, Consult Factory for details.