Offers personalized flexibility in a compact size and low price, our Nexdep system can be manufactured to meet customer needs. Thermal resistance evaporation capacity, sputtering deposition, electron beam evaporation, ion beam deposition.

    Process capabilities

  • Resistive thermal evaporation.
  • Sputter deposition.
  • Electron beam evaporation.
  • Ion assisted deposition.
  • Custom available.



  • 400mm x 475mm tall D-shaped chamber with large hinged front door.
  • Aluminum or stainless steel chamber options.
  • Custom designed to meet your process requirements.
  • Support for multiple PVD processes.
  • 600mm x 1000mm system footprint.
  • International input voltages available.
  • Recipe based advanced multi-layer deposition control with user logon control.
  • Sequential or co-deposition.
  • Standard fixturing supports up to 200mm diameter please contact us for assistance with larger substrate sizes.
  • Factory training included with every system.
  • Our detailed training manual teaches new users how to operate and maintain the equipment.
  • User safety is held paramount with features such as cutting power to sources when the chamber is open.
  • 1-year warranty with responsive and caring customer service.


  • Automated single button pump down and venting sequences.
  • Rotary vane or dry scroll rough pump options.
  • High vacuum provided by turbo pump.
  • Pneumatic air line filter prevents unwanted debris from reaching and damaging critical components.
  • Easy access system interior with hinged electrical panel.


  • Shadow Mask and substrate alignment fixturing is available.
  • Sensors are rigidly mounted to ensure calibration is maintained.
  • In co-deposition configurations QCM sensors are carefully isolated to ensure there is no interference from adjacent source material.
  • Stainless steel isolation shields help to protect sources from cross contamination.
  • Substrate heating, cooling and biasing available.
  • Planetary motion available.