FEATURES
- Ideal for wet etching processes :
- Spin coater system.
- Hot plate.
- Chronometer.
- Different levels of work:
- First level: Developed.
- Second level: Etching.
- Deionized water system( DIW ).
SPECIFICATIONS
| Type | Manual controller system |
| Work sections | Developing level and Etching level |
| substrate size | Wafer from 10 mm to 100 mm ~ ( 100 mm diameter ) |
| Power | AC100~240V, 1.3A, 50~60Nz, 1 phase |
| Dimension | 800(W) x 550(D) x 1300(H) |
