FEATURES
- HMDS Vapor-prime Oven built on production proven photo track platform.
- Suitable for IC, PSS LED, MEMs and other substrates.
- Wafer size is 4”.
- PC based central control system.
- Full featured software enhances process capability.
- Low cost for Ownership, High productivity.
- Small Foot-print.
- Traceable system and operation history.
- Operation error-free, production integrated recipe selection.
- Production summary: Lot history.
- Comprehensive alarm management.
- Teach-mode calibration.
- Single/Continuous component exercise.
- Single module manual operation: Module recipe tuning.
- Unlimited flow recipes and attachable module recipes.
Software Benefit
- Distributed PC & PLC module controller.
- Interrupt controller and watchdog timer.
- PLC expandable I/O.
- 4 serial ports, 2 with RS232/422/485.
- Simplified signal wiring.
- 3 colors tower light.
- Modular utility monitoring.
- Easier OEM interface.
Module Controller Benefits
- Digital temperature controller (Watlow).
- Special Vapor Prime Chamber design.
- Clear anodized Aluminium Material.
- Safety Interlock feature EXH, Over temp., Lid Cover.
- Designed to minimize HMDS consumption.
- Touch screen monitoring & data entry.
Enhanced Hardware Benefit
SPECIFICATIONS
| System Basic | Distributed module controller |
| Wafer size | 4″ wafer |
| Wafer handling | Random robot transfer |
| Wafer contact material | Anodized aluminum |
| Position accuracy | ≤ 0.1 mm |
| SECS/GEM | Option |
