• HMDS Vapor-prime Oven built on production proven photo track platform.
  • Suitable for IC, PSS LED, MEMs and other substrates.
  • Wafer size is 4”.
  • PC based central control system.
  • Full featured software enhances process capability.
  • Low cost for Ownership, High productivity.
  • Small Foot-print.

    Software Benefit

  • Traceable system and operation history.
  • Operation error-free, production integrated recipe selection.
  • Production summary: Lot history.
  • Comprehensive alarm management.
  • Teach-mode calibration.
  • Single/Continuous component exercise.
  • Single module manual operation: Module recipe tuning.
  • Unlimited flow recipes and attachable module recipes.

    Module Controller Benefits

  • Distributed PC & PLC module controller.
  • Interrupt controller and watchdog timer.
  • PLC expandable I/O.
  • 4 serial ports, 2 with RS232/422/485.
  • Simplified signal wiring.
  • 3 colors tower light.
  • Modular utility monitoring.
  • Easier OEM interface.

    Enhanced Hardware Benefit

  • Digital temperature controller (Watlow).
  • Special Vapor Prime Chamber design.
  • Clear anodized Aluminium Material.
  • Safety Interlock feature EXH, Over temp., Lid Cover.
  • Designed to minimize HMDS consumption.
  • Touch screen monitoring & data entry.


System Basic Distributed module controller
Wafer size 4″ wafer
Wafer handling Random robot transfer
Wafer contact material Anodized aluminum
Position accuracy ≤ 0.1 mm