FEATURES
- 21” OD, 15”x15” Substrates.
- 450 mm Wafer.
- Large Environmental Chamber with Megasonic DI, Brush, Hot DI, High Pressure DI, Heated N2, Chemical Dispense Arm.
- Variable Speed Brush with Chemical Dispense.
- PC Controlled with LabVIEW Software.
- Touchscreen User Interface.
- Manual Load and Unload.
- Safety Interlocks and Alarm.
- 30”D x 26”W Footprint.
APPLICATIONS
- Si Wafers.
- Saphire Wafers.
- Chips on Wafer Frame.
- Display Panels.
- ITO Coated Displays.
- Patterned and Un-patterned Masks.
- Mask Blanks.
- Pelliclized reticles.
- Contact Masks.
Cleaning
- Resist Coating.
- Resist Lift-Off.
- Resist stripping with Piranha.
Photoresist Processing
- Metal Etching of Al, Au, Cr, Ti.
Etching
OPTIONS
- H2SO4 and H2O2 Dispensed and Mixed on the Wafer.
- IR Heating > 200 °C.
- Brush Clean.
- Megasonic DI Water Clean.
- Heated N2 and Spin Dry.
Piranha Cleaning
- Removes CMP Particles with Brush and Megasonic DI Cleaning.
- Chemical Dispense Arm.
- Chemical Dispense Canisters.
- Special Chucks for Front Side and Back Side Brush Cleaning.
- Variable Speed (< 800 rpm)PVA Brush.
- Adjustable Brush/Wafer Contact Pressure.
- Chemical Dispense Through Brush.