FEATURES
- Easy operation UI.
- PC Operation with PLC control.
- Image grab & Data log.
- More than 100 Program recipes.
- Motorized joystick control.
- Microscope position control system.
- Enable Ceramic substrate for Bump.
SPECIFICATIONS
| Type | Joystick control Semi-Auto (Mask Aligner) |
| Mask size | up to 13″ x 13″ |
| Substrate size | piece to 12″ x 12″ |
| UV lamp & Power | 2kW & power supply 5kW & Power supply |
| Uniform beam size | 13.25″ x 13.25″ |
| Beam Uniformity | <±5% |
| Beam wavelength | 350 ~ 450nm |
| 365nm Intensity | 15~20mW/cm2 (2 kW) 25~60mW/cm2 (5 kW) |
| Alignment accuracy | 1um |
| Process resolution | 1um@1um PR thickness with vacuum contact |
| Process mode | Soft, Hard, Vacuum contact & Proximity |
| Substrate chuck moving | x,y, z & θ (Motorized) |
| Options | CCD BSA UV Intensity meter |
